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In the potting or encapsulation process, the assembled printed circuit board is placed in a housing or silicone mold and is filled with a two-component resin. The connections, controls, sensors and other external signalers are not poured in during the process and cannot affect the functionality of the printed circuit board. Potting or encapsulation protects the sensitive, logic circuit of the printed circuit board from environmental influences and mechanical stress.

In addition to protecting against external influences, casting resin can also protect the printed circuit board from electrical breakdowns of up to 20 kV and the resin can also conduct and dissipate the heat produced by some specific components into the environment.
Counterfeiting your printed circuit board by competitors is also virtually impossible.

The service life of a printed circuit board is extended by potting or encapsulation, counterfeiting is virtually impossible and operational reliability is significantly improved.